Dimension measurement approach for metal-material

Optics: measuring and testing – Of light reflection

Reexamination Certificate

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C356S630000

Reexamination Certificate

active

07088449

ABSTRACT:
Dimensional parameters of metal-containing structures such as films, interconnects, wires and stripes, and nanoparticles are detected using an approach involving plasmon-excitation and one or more metal-constituency characteristics of the metal-containing structures. According to an example embodiment of the present invention, plasmon-exciting light is used to excite plasmons in a structure, the plasmon excitation being responsive to the metal constituency. A characteristic of light reflected from the structure is then used to detect dimensional parameters of the structure. In one implementation, a characteristic of the reflected light that is related to the state of plasmon excitation in the structure is used to detect the dimensional parameters. In another implementation, the angle of incidence of the plasmon-exciting light is used in connection with an intensity-related characteristic of light reflected from structure to detect one or more dimensions of the structure. In still another implementation, the intensity of different wavelengths of the reflected light is used to determine one or more dimensions of the structure. With these approaches, the dimensions of a variety of structures such as metal films, interconnects, wires, and stripes are determined.

REFERENCES:
patent: 5028132 (1991-07-01), Hickel et al.
patent: 5237392 (1993-08-01), Hickel et al.
patent: 5822073 (1998-10-01), Yee et al.
patent: 5991048 (1999-11-01), Karlson et al.
patent: 6373577 (2002-04-01), Brauer et al.
patent: 6395563 (2002-05-01), Eriguchi
patent: 6597463 (2003-07-01), Singh et al.
patent: 6633392 (2003-10-01), Singh et al.
patent: 6704101 (2004-03-01), Rangarajan et al.
patent: 6758612 (2004-07-01), Tabery et al.
patent: 6771374 (2004-08-01), Rangarajan et al.
patent: 2001/0040130 (2001-11-01), Lorch et al.
patent: 2002/0126290 (2002-09-01), Naya
patent: 2003/0052084 (2003-03-01), Tabery et al.
Hui Wang et al., Method for Electropolishing Metal Film on Substrate, Jul. 22, 2002, U.S. Appl. No. 60/397,941.
C. Berger, R. Kooyman, J. Greve,Surface Plasmon propagation near an index step, MESA Institute, Applied Optics Group, University of Twente, P.O. Box. 217, 7500 AE Enschede, The Netherlands. Nov. 8, 2002 website printout from http://www.lps.ens.fr/˜berger/articles/art4/OptComm.htm, pp. 1-9.
O. Martin,Breaking the Diffraction Limit with Plasmon Optics: 20 nm Optical Lithography using 600 nm Illumination Wavelength, Swiss Federal Institute of Technology, IFH, ETZ-G96, Gloriastrasse 35, 8092 Zurich, pp. 1-2.
T. Thio, H.J. Lezec, T.W. Ebbesen, K.M. Pellerin, G.D. Lewen, A. Nahata and R.A. Linke,Giant Optical Transmission of Sub-wavelength Apertures: Physics and Applications, TNT2001 Sep. 3-7, 2001, Segovia-Spain, http://www.neci.nj.nec.com/homepages/thio, pp. 1-3.
Diethelm Johnannsmann,Simultaneous Determination of Optical and Acoustic Thickness Using Surface Plasmon Resonance Spectroscopy and Quartz Crystal Microweighing, Max-Planck-Institute for Polymer Research, Mainz, Germany, pp. 1-16.
FY 72: Photons and lightwaves, Project 6: Total Internal Reflection and Surface Plasmons, Nov. 8, 2002 website printout from http://www.fys.sdu.dk/Fys72/html/F72proj6.html, pp. 1-6.
Alec Reader, Philips Analytical, Almelo, The Netherlands,In-line control of metal&dielectric films, pp. 1-2.
Rebecca J. Bussjager and H. Angus Macleod,Using surface plasmon resonances to test the durability of silver-copper films, Applied Optics, vol. 35, No. 25, Sep. 1, 1996, pp. 1-4.
H. Raether,Surface Plasmons on Smooth and Rough Surfaces and on Gratings, Springer, Berlin, 1988, p. 13.

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