Digital micromirror device module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S707000, C361S715000, C257S706000, C257S712000, C257S718000, C257S727000, C165S080300

Reexamination Certificate

active

07660124

ABSTRACT:
A digital micromirror device (DMD) module includes a circuit board, a DMD element, a soft elastic pad, a heat dissipation pad and a heat sink. The circuit board includes a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface. The DMD element is electrically connected to the circuit board. The soft elastic pad is disposed on the first surface of the circuit board and surrounds the through hole. The heat dissipation pad passes through the through hole and contacts the DMD element. The soft elastic pad is sandwiched between the circuit board and the heat sink, the heat dissipation pad is sandwiched between the heat sink and the DMD element, and the heat sink contacts the soft elastic pad and the heat dissipation pad, so as to apply a force to the soft elastic pad and the heat dissipation pad.

REFERENCES:
patent: 6791838 (2004-09-01), Hung et al.
patent: 6816375 (2004-11-01), Kalyandurg
patent: 6914783 (2005-07-01), Rogers et al.
patent: 2006/0176453 (2006-08-01), Miyamoto
patent: 2006/0227514 (2006-10-01), Kang et al.
patent: 2008/0247168 (2008-10-01), Chien et al.
patent: 2009/0086171 (2009-04-01), Sun

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