Digital cross connect/interconnect module

Details Digital cross connect/interconnect module Digital cross connect/interconnect module

1999-06-22

2001-06-05

Nguyen, Khiem (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Insulating body divided parallel to longitudinal axis of...

C439S668000, C439S076100

Reexamination Certificate

active

06241562

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to digital communication networks, and in particular, digital signal cross-connect modules for cross-connecting digital telecommunications circuits.
DESCRIPTION OF THE RELATED ART
Digital signal cross-connect (DSX) equipment plays an important part in the installation, monitoring, testing, restoring, and repairing of digital communications networks. Digital signal cross-connect modules are often used to provide cross-connections of digital signal lines at locations that are suited for testing and repairing the digital lines. For instance, many telephone service providers' central offices have digital signal cross-connect modules. A single DSX module generally interconnects two telecommunications apparatuses of a telecommunications network. The module is typically mounted in a rack or bank with similar modules, the bank forming a digital signal cross-connect unit (DSX unit). The DSX modules provide a point of access to the digital signals being transmitted over the digital lines of the telecommunications network, yet appear as almost invisible to the rest of the network. By utilizing the DSX modules, an operator can monitor, test and repair the digital equipment which is used by the telecommunications network without significantly interfering with the transmission of signals.
One type of digital signal cross-connect module known in the art is the Type 440IS module, produced by Lucent Technologies. The Type 440IS module is so named because it includes Type 440IS coaxial jacks, also produced by Lucent Technologies, the IS standing for “internal switch.” Such a coaxial jack and associated module is described in U.S. Pat. No. 5,882,217, assigned to Lucent Technologies, the disclosure of which is incorporated herein by reference. Type 440IS modules are presently made of a seven (7) inch by five and a half (5.5) inch die cast metal case. The metal case houses a printed circuit board (PCB) which connects a first set of coaxial jacks to a second set of coaxial jacks for cross-connecting signals. Openings formed in the metal case allow the coaxial jacks on the PCB to be connected to coaxial lines. The separate portions of the metal case are secured to one another using screws or other similar attachment means. The PCB is also secured to the metal case using screws or other attachment means. Further, in order to provide isolation, insulators are often interposed between the metal housing and the elements on the PCB board. The large number of components necessary to fabricate the conventional DSX module makes the module heavy, and time consuming to manufacture(as the elements are typically screwed together by hand).
Thus, a major drawback associated with Type 440IS and other digital signal cross-connect modules is the number of parts that are associated with each module. Each module is currently formed of a die cast metal housing to which components are attached by screws and brackets. The multitude of parts makes the conventional module time-consuming to manufacture. Additionally, the conventional module is extremely heavy due to the metal casing. Hence, there is currently a need for a digital signal cross-connect module which is lighter and easier to produce and assemble.
SUMMARY OF THE INVENTION
The present invention is a digital signal cross-connect module which includes a module housing formed in two parts. The two parts may be engaged with one another to form a complete module housing, using complimentary tabs and slots on the respective parts of the housing.
The above and other advantages and features of the present invention will be better understood from the following detailed description of the preferred embodiments of the invention which is provided in connection with the accompanying drawings.


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