Diffusion soldered semiconductor device

Details Diffusion soldered semiconductor device Diffusion soldered semiconductor device

2004-03-31

2010-12-14

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S736000, C257S737000

Reexamination Certificate

active

07851910

ABSTRACT:
The invention relates to a process for the multi-stage production of diffusion-soldered joints for power components with semiconductor chips, the melting points of diffusion-soldering alloys and diffusion-soldered joints being staggered in such a manner that a first melting point of the first diffusion-soldering alloy is lower than a second melting point of the second diffusion-soldering alloy, and the second melting point being lower than a third melting point of a first diffusion-soldered joint of the first diffusion-soldering alloy.

REFERENCES:
patent: 2746140 (1956-05-01), Belser
patent: 4988035 (1991-01-01), Ueno et al.
patent: 5061442 (1991-10-01), Ozimek
patent: 5225157 (1993-07-01), McKay
patent: 5249100 (1993-09-01), Satoh et al.
patent: 5882955 (1999-03-01), Huang et al.
patent: 6083770 (2000-07-01), Sato et al.
patent: 6293457 (2001-09-01), Srivastava et al.
patent: 6888167 (2005-05-01), Slater et al.
patent: 2002/0047217 (2002-04-01), Zakel et al.
patent: 2005/0048758 (2005-03-01), Hosseini et al.
patent: 2930779 (1980-02-01), None
patent: 4016384 (1990-11-01), None
patent: 19528441 (1996-09-01), None
patent: 19531158 (1997-02-01), None
patent: 19532250 (1997-03-01), None
patent: 19615841 (1997-11-01), None
patent: 19730118 (1999-01-01), None
patent: 10014308 (2001-10-01), None
patent: 10208635 (2003-09-01), None
patent: 0114952 (1984-08-01), None
patent: 0055368 (1985-06-01), None
patent: 1262267 (2002-04-01), None
patent: 54150076 (1979-11-01), None
patent: 05237694 (1993-09-01), None
patent: 2000294444 (2000-10-01), None
patent: 2001077049 (2001-03-01), None
patent: 2002305213 (2002-10-01), None
patent: 0021346 (2000-04-01), None
patent: 03072288 (2003-09-01), None
Chin et al., Advances in bonding technology for electronic packaging, Journal of Electronic Packaging, vol. 115, Jun. 1993, 1 pp.

Affiliated with

Also associated with

Rating

Diffusion soldered semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diffusion soldered semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diffusion soldered semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4225892