Diffusion solder position, and process for producing it

Details Diffusion solder position, and process for producing it Diffusion solder position, and process for producing it

2008-05-06

2008-05-06

Ghyka, Alexander (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257SE21509, C438S614000

Reexamination Certificate

active

07368824

ABSTRACT:
A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for producing the diffusion solder position and for producing an electronic power component, which has a plurality of diffusion solder positions, is provided.

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