Diffusion joining method and a paste used therefor

Details Diffusion joining method and a paste used therefor Diffusion joining method and a paste used therefor

1995-02-27

1996-09-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2282481, H05K 334

Patent

active

055516262

ABSTRACT:
The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170.degree. C. more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.

REFERENCES:
patent: 4228944 (1980-10-01), Inamura et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4569876 (1986-02-01), Nakakita
patent: 4719134 (1988-01-01), Ely
patent: 4768787 (1988-09-01), Shira
Low-Temperature Solid-State Bonding of Copper, Journal of Materials Engineering and Performance, No. 1, Feb. 1, 1992, pp. 35-44.

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