Diffusion isolation layer for maskless cladding process

Details Diffusion isolation layer for maskless cladding process Diffusion isolation layer for maskless cladding process

1986-01-10

1988-11-22

Lilling, Herbert J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524430, 524559, C08K 336, C08K 322

Patent

active

047866748

ABSTRACT:
In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

REFERENCES:
patent: 4046586 (1977-09-01), Uhlmann et al.
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patent: 4356232 (1982-10-01), Tadokoro et al.
patent: 4411956 (1983-10-01), Matsufuji et al.
patent: 4482538 (1984-11-01), Davies
patent: 4575475 (1986-03-01), Nakayama et al.
patent: 4599266 (1986-07-01), Nakayama et al.
Binder Systems for Multilayer Glass-Ceramic Substrate by R. N. Master et al., IBM Technical Disclosure Bulletin, vol. 22, No. 4, Sep. 1979, p. 1542.
Electroplating of MLC Substrates Using a Nonprecious Metal Shorting Material by R. J. Kowalczyk, IBM Technical Disclosure Bulletin, vol. 22, No. 4, Sep. 1979, pp. 1439-1440.

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