Diffusion bonding process of two-phase metal alloys

Details Diffusion bonding process of two-phase metal alloys Diffusion bonding process of two-phase metal alloys

2006-01-10

2006-01-10

Silverman, Stanley S. (Department: 1754)

Alloys or metallic compositions

Palladium base

C428S665000, C228S245000, C228S182000

Reexamination Certificate

active

06984358

ABSTRACT:
A method for producing diffusion bonds between components formed of tungsten heavy alloy (WHA) uses aid material to accelerate diffusion across the joint surfaces. The aid material consists of an alloy of palladium (Pd) with one or more of the secondary elements of nickel (Ni), iron (Fe), or cobalt (Co). The secondary elements are selected to correspond to the secondary elements present in the components. The diffusion bonding is carried out by placing diffusion aid material between the joint surfaces of adjacent components, applying a pressure across the joint surfaces, and processing the assembly through a thermal profile. Structures of WHA with complex shapes, interior volumes and/or large sizes can be formed. The joint properties are equal to or superior to those of the parent material of the components.

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William R. Spencer, U.S. patent application No. 10/453,542, filed Jun. 4, 2003, entitled “Method of Liquid Phase Sintering a Two-Phase Alloy”.

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