Diffusion bonding process of two-phase metal alloys

Alloys or metallic compositions – Palladium base

Reexamination Certificate

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C428S665000, C228S245000, C228S182000

Reexamination Certificate

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06984358

ABSTRACT:
A method for producing diffusion bonds between components formed of tungsten heavy alloy (WHA) uses aid material to accelerate diffusion across the joint surfaces. The aid material consists of an alloy of palladium (Pd) with one or more of the secondary elements of nickel (Ni), iron (Fe), or cobalt (Co). The secondary elements are selected to correspond to the secondary elements present in the components. The diffusion bonding is carried out by placing diffusion aid material between the joint surfaces of adjacent components, applying a pressure across the joint surfaces, and processing the assembly through a thermal profile. Structures of WHA with complex shapes, interior volumes and/or large sizes can be formed. The joint properties are equal to or superior to those of the parent material of the components.

REFERENCES:
patent: 2958937 (1960-11-01), Wagner
patent: 3110101 (1963-11-01), Kieffer et al.
patent: 3276113 (1966-10-01), Metcalfe et al.
patent: 3386159 (1968-06-01), Milch et al.
patent: 3577233 (1971-05-01), Gamer
patent: 3657801 (1972-04-01), Hershenson
patent: 3714702 (1973-02-01), Hammond
patent: 3932880 (1976-01-01), Nara et al.
patent: 4281041 (1981-07-01), Koehler
patent: 4515610 (1985-05-01), Bhatti
patent: 4572925 (1986-02-01), Scarlett
patent: 4605599 (1986-08-01), Penrice et al.
patent: 4710235 (1987-12-01), Scruggs
patent: 4736400 (1988-04-01), Koller et al.
patent: 4736883 (1988-04-01), Morgan et al.
patent: 4793969 (1988-12-01), Johnson et al.
patent: 5318217 (1994-06-01), Stinson et al.
patent: 5360991 (1994-11-01), Abys et al.
patent: 5370753 (1994-12-01), Lees et al.
patent: 5530228 (1996-06-01), Burnett et al.
patent: 5645747 (1997-07-01), Matsen et al.
patent: 5675177 (1997-10-01), Abys et al.
patent: 5683822 (1997-11-01), Hasegawa et al.
patent: 5699955 (1997-12-01), Shimizu et al.
patent: 5704538 (1998-01-01), Mittendorf
patent: 5759300 (1998-06-01), Hasegawa et al.
patent: 5760378 (1998-06-01), Christian et al.
patent: 5950064 (1999-09-01), Robinson et al.
patent: 6068813 (2000-05-01), Semel
patent: 6071130 (2000-06-01), Johnson
patent: 6136105 (2000-10-01), Spencer
patent: 6156093 (2000-12-01), Spencer
patent: 6335107 (2002-01-01), Abys et al.
patent: 6402893 (2002-06-01), Lumiala et al.
patent: 6413294 (2002-07-01), Spencer
patent: 6517893 (2003-02-01), Abys et al.
William R. Spencer, U.S. patent application No. 10/453,542, filed Jun. 4, 2003, entitled “Method of Liquid Phase Sintering a Two-Phase Alloy”.

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