Diffusion bonding of aluminum and aluminum alloys

Details Diffusion bonding of aluminum and aluminum alloys Diffusion bonding of aluminum and aluminum alloys

1993-04-09

1994-12-27

Yee, Deborah

Metal treatment

Process of modifying or maintaining internal physical...

Carburizing or nitriding using externally supplied carbon or...

228193, C21D 106, B23K 3522

Patent

active

053761871

ABSTRACT:
The diffusion bonding of aluminum and aluminum alloys presents problems because, when left exposed to the atmosphere even for a short time, they acquire an extremely tenacious surface oxide layer that inhibits or prevents satisfactory diffusion bonding. Unlike titanium, this oxide layer is not absorbed at diffusion bonding temperatures. The present invention comprises a method of reducing oxidation of a surface of aluminum or aluminum alloy by causing a nitride film to form on the surface. This film is believed to prevent oxidation of the aluminum or aluminum alloy, but to be absorbable into it at diffusion bonding temperatures. In the preferred embodiment shown in FIG. 1, the nitride film is applied to the piece of aluminum or aluminum alloy (10) in a vacuum chamber (4) by sputtering with nitrogen ions, or by heating the piece (10) in a nitrogen gas atmosphere.

REFERENCES:
patent: 4522660 (1985-06-01), Suzuki et al.
patent: 4597808 (1986-07-01), Tachikawa et al.
patent: 4698233 (1987-10-01), Ohira et al.
patent: 5222653 (1993-06-01), Joyce et al.
patent: 5224645 (1993-07-01), Cooper et al.

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