Metal fusion bonding – Process – With shaping
Patent
1987-08-17
1988-09-06
Godici, Nicholas P.
Metal fusion bonding
Process
With shaping
228193, 228219, 228243, 291568H, 294211, 416 97A, B23K 2000, B23K 2014, B23K 2900
Patent
active
047687002
ABSTRACT:
A turbine blade spar wall surrounds a coolant plenum of the blade and is cast with an intermediate thickness exceeding its final or design thickness. The outer surface of the spar wall is machined to form a plurality of incomplete holes extending to bottoms located at the final thickness dimension of the spar wall. A pre-formed sheath of porous metal is fit closely around the spar wall outer surface with coolant pores in the sheath communicating with the incomplete holes. A high pressure inert gas is introduced into the coolant plenum concurrently with application of compressive forces to the sheath as both the sheath and the spar wall are raised to a high temperature whereby the sheath is diffusion bonded to the spar wall. The inert gas pressure in the coolant plenum reinforces the spar wall against the compressive forces. The inner surface of the spar wall is then chemically machined to an etch depth dimension which brings the spar wall to its design thickness and simultaneously removes the bottoms of the incomplete holes so that the incomplete holes become complete holes between the coolant plenum and the sheath of porous metal.
REFERENCES:
patent: 3606573 (1971-09-01), Emmerson et al.
patent: 3623204 (1971-11-01), Wagle
patent: 3700418 (1972-10-01), Mayeda
patent: 4042162 (1977-08-01), Meginnis et al.
patent: 4383854 (1983-05-01), Dembowski et al.
General Motors Corporation
Godici Nicholas P.
Heinrich Samuel M.
Schwartz Saul
LandOfFree
Diffusion bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Diffusion bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diffusion bonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1602128