Diffusion barrier and adhesive for PARMOD.TM. application to rig

Details Diffusion barrier and adhesive for PARMOD.TM. application to rig Diffusion barrier and adhesive for PARMOD.TM. application to rig

1999-08-06

2000-11-07

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 427125, 427146, 427191, 427229, 427301, 4274071, B05D 512, B05D 302

Patent

active

06143356&

ABSTRACT:
PARMOD.TM. materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temperatures to form a highly conductive, well bonded, well consolidated pure metal component. The adhesion of PARMOD.TM. conductors on an electronic component is enhanced by printing the PARMOD.TM. on a polyimide coating which has been applied to the electronic component.

REFERENCES:
patent: 4808274 (1989-02-01), Nguygen
patent: 5156710 (1992-10-01), Chen et al.
patent: 5741598 (1998-04-01), Shiotani et al.
patent: 5882722 (1999-03-01), Kydd

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