Diffuser with spiral opening pattern for electroplating...

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S242000, C204S275100, C204S286100, C204S297010, C204SDIG007

Reexamination Certificate

active

06881309

ABSTRACT:
In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.

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