Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate
2007-06-12
2007-06-12
Toatley, Jr., Gregory J. (Department: 2886)
Optics: measuring and testing
By alignment in lateral direction
With registration indicia
Reexamination Certificate
active
10858691
ABSTRACT:
A method for measuring overlay in semiconductor wafers includes a calibration phase in which a series of calibration samples are analyzed. Each calibration sample has an overlay that is known to be less than a predetermined limit. A difference spectrum for a pair of reflectively symmetric overlay targets is obtained for each calibration sample. The difference spectra are then combined to define a gross overlay indicator. In subsequent measurements of actual wafers, difference spectra are compared to the overlay indicator to detect cases of gross overlay.
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Huang Hsu-Ting
Johnson Kenneth
Sezginer Abdurrahman
Akanbi Isiaka O.
Stallman & Pollock LLP
Toatley , Jr. Gregory J.
Tokyo Electron Limited
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