Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1975-09-02
1976-11-23
Smith, Al Lawrence
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228180R, 228257, 228260, 118410, B23K 306
Patent
active
039932354
ABSTRACT:
A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce a wave having increasing pressure along its flow path whereby a substantially uni-directional wave may be formed which is highest adjacent its rear.
REFERENCES:
patent: 3004505 (1961-10-01), Dvorak
patent: 3207128 (1965-09-01), Leavitt et al.
patent: 3217959 (1965-11-01), Renzo
patent: 3398873 (1968-08-01), Wegener et al.
patent: 3713876 (1973-01-01), Lavric
Hollis Engineering, Inc.
Ramsey K. J.
Smith Al Lawrence
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