Differential pressure wave soldering system

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

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228180R, 228257, 228260, 118410, B23K 306

Patent

active

039932354

ABSTRACT:
A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce a wave having increasing pressure along its flow path whereby a substantially uni-directional wave may be formed which is highest adjacent its rear.

REFERENCES:
patent: 3004505 (1961-10-01), Dvorak
patent: 3207128 (1965-09-01), Leavitt et al.
patent: 3217959 (1965-11-01), Renzo
patent: 3398873 (1968-08-01), Wegener et al.
patent: 3713876 (1973-01-01), Lavric

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