Differential pressure application apparatus for use in...

Details Differential pressure application apparatus for use in... Differential pressure application apparatus for use in...

2011-05-03

2011-05-03

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C451S041000, C156S345120

Reexamination Certificate

active

07935216

ABSTRACT:
An apparatus for applying different amounts of pressure to different locations of a semiconductor device structure or other substrate during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pressurization structures configured to individually apply pressure to a major surface of the semiconductor device structure during polishing thereof. Systems including the pressure application apparatus, as well as differential pressure application methods and polishing methods are also disclosed.

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