Differential multi-flow control nozzles, apparatus and process

Details Differential multi-flow control nozzles, apparatus and process Differential multi-flow control nozzles, apparatus and process

1996-08-30

1998-07-28

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 32, 228 19, 228264, B23K 1012, B23K 1018

Patent

active

057852375

ABSTRACT:
Process, apparatus and nozzle device are available for controlling the soldering/and or desoldering of a land grid array (LGA) component and corresponding circuit grid present in the surface of a printed circuit board (PCB). The nozzle device comprises a vacuum cup for supporting the LGA parallel to the PCB, with the LGA and the circuit grids in contact or slightly spaced, a device for directing a continuous flow of an inert hot gas, such as nitrogen, from a gas source against the upper surface of a dielectric body of a component to conduct heat therethrough to melt an underlying LGA, vents for venting the major volume of the hot gas, adjacent the upper surface of the body of the component, and one or more vertical passages for directing a minor volume of the total gas flow from the upper surface of the component around the edges, under and horizontally through the array into a discharge chamber, and out a gas outlet. A thermocouple preferably is located at the gas outlet for sensing the temperature of the minor volume of the hot outlet gas and regulating the process, thereby avoiding exposing the melted array to the possibly disruptive force of the total hot gas flow.

REFERENCES:
patent: 5207372 (1993-05-01), Funari et al.
patent: 5419481 (1995-05-01), Lasto et al.
patent: 5560531 (1996-10-01), Ruszowski

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