Dielectric vias within multi-layer 3-dimensional structures/subs

Details Dielectric vias within multi-layer 3-dimensional structures/subs Dielectric vias within multi-layer 3-dimensional structures/subs

1993-09-27

1994-10-11

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 428137, 361748, 361750, B32B 0900

Patent

active

053545990

ABSTRACT:
An array of dielectric vias formed in the insulating layers of a unitized multilayer circuit structure wherein the dielectric vias have a dielectric constant different from the dielectric constant of the insulating layers in which they are formed.

REFERENCES:
patent: 4749621 (1988-06-01), Araps et al.
patent: 4816323 (1989-03-01), Inoue
patent: 4857381 (1989-08-01), Suzuki
patent: 5117069 (1992-05-01), Higgins et al.
patent: 5139852 (1992-08-01), Boise et al.
Printed Circuits Handbook, Coombs, ed. 1989, p. G.9.

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