Dielectric resonator including a plurality of solder bumps and m

Wave transmission lines and networks – Resonators – Coaxial or shielded

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333206, 361760, H01P 704, H05K 334

Patent

active

055171621

ABSTRACT:
A dielectric resonator device includes a dielectric member, inner conductors provided in the dielectric member, an outer conductor formed on an outer surface of the dielectric member, signal input and output electrodes formed on the outer surface of the dielectric member opposing a mounting substrate and coupled with the inner conductors, and solder bumps formed on the outer conductor on its surface opposing the mounting substrate and on the signal input and output electrodes. By heating the dielectric resonator device opposing the mounting substrate, electrical and mechanical connections may be made therebetween through the solder bumps, while preventing the formation of solder bridges.

REFERENCES:
patent: 4463059 (1984-07-01), Bhattacharya et al.
patent: 4673902 (1987-06-01), Takeda et al.
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4806725 (1989-02-01), Narizuka et al.
patent: 4879533 (1989-11-01), de Muro et al.
patent: 5023580 (1991-06-01), Kim et al.
patent: 5045824 (1991-09-01), Metroka
patent: 5208213 (1993-05-01), Ruby
Ariyoshi et al., "Mixed IC Construction of Solder Melting Connection type", Research Practical Application Report vol. 26, No. 6, 1977, pp. 1603-1629.

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