Dielectric materials

Details Dielectric materials Dielectric materials

1987-04-02

1988-05-31

Bell, James J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156161, 1563075, 1563077, 427322, 427394, B65H 8100

Patent

active

047478977

ABSTRACT:
Dielectric materials having low dielectric constant are provided, the materials comprising fabrics impregnated with thermosetting resins, at least a portion of the fibers in the fabrics being fluorocarbon fibers. Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in the fabrication of multilayer printed circuit boards.

REFERENCES:
patent: 4241132 (1980-12-01), Pratt et al.
patent: 4695497 (1987-09-01), Nagy et al.

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