Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1992-11-27
1995-02-07
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257524, 257776, H01L 2904, H01L 2906
Patent
active
053878175
ABSTRACT:
Upper and lower metallizations are formed on a semiconductor substrate so as to prevent the upper metallization from being inferior wherein the semiconductor substrate includes a plurality of element forming regions, a plurality of isolation insulating regions for surrounding said element forming regions, and a supporter region extending between the isolation insulating regions. The lower metallization is formed on the supporter region and the upper metallization is formed to extend from one element forming region to another element forming regions while striding over the lower metallization not to cross the region where the lower metallization adjoins the isolation insulating regions. The lower metallization may be formed from one element forming region to another element forming regions while the upper metallization is formed to stride over the lower metallization.
REFERENCES:
patent: 4332075 (1982-06-01), Ota et al.
patent: 4926234 (1990-05-01), Katoh
patent: 5057895 (1991-10-01), Beasom
Limanek Robert P.
OKI Electric Industry Co., Ltd.
Williams Alexander Oscar
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