Dielectric isolation fabrication for laser trimming

Details Dielectric isolation fabrication for laser trimming Dielectric isolation fabrication for laser trimming

1984-05-09

1985-04-09

Larkins, William D.

Electrical resistors

Incased, embedded, or housed

Element in insulation with outer metallic sheath

357 51, 357 55, 357 59, 338195, 219121LJ, H01L 2712, H01L 2702, H01L 1000, B23K 900

Patent

active

045105189

ABSTRACT:
Single crystalline dielectrically isolated islands are formed providing an opening in the bottom dielectric isolation of selected islands before the application of the polycrystalline support. Thin film resistor material is formed and delineated on an insulative layer over the signal crystalline island juxtaposed with the opening of the bottom dielectric isolation. The thin film resistive layer is trimmed using a laser.

REFERENCES:
patent: 3858237 (1974-12-01), Sawazaki et al.
patent: 3886587 (1975-05-01), Nicolay
patent: 3956034 (1976-05-01), Nicolay
patent: 4146673 (1979-03-01), Headley
patent: 4179310 (1979-12-01), Compton et al.
patent: 4210925 (1980-07-01), Morcom et al.
patent: 4255209 (1981-03-01), Morcom et al.
patent: 4272775 (1981-06-01), Compton et al.
patent: 4409609 (1983-10-01), Fukuda

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