Dielectric isolated type semiconductor device provided with bipo

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257526, 257487, H01L 2900, H01L 2358

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active

055920152

ABSTRACT:
A semiconductor device is provided which makes a high withstand voltage bipolar transistor small and prevents deterioration in a switching speed of the transistor. A silicon oxide layer is formed on a silicon substrate, and a semiconductor island of one conductivity type which is isolated laterally by an isolation trench is formed on the silicon oxide layer. A silicon oxide film is formed on an outer periphery portion of the semiconductor island to bury the trench. In the semiconductor island, a bipolar transistor, namely a base region of the other conductivity type, is formed, and in the base region an emitter region of one conductivity type is formed and a collector region of one conductivity type is further formed. In the semiconductor island a diffusion region of the other conductivity type for extracting excessive carriers to which a constant electric potential is applied is further formed.

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patent: 4819052 (1989-04-01), Hutter
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patent: 5241211 (1993-08-01), Tashiro
patent: 5449946 (1995-09-01), Sakikibara et al.
Ueno et al, "A Fully Functional 1K ECL RAM On A Bonded SOI Wafer", Institute Of Electrical And Electronics Engineers, No. 1988, Dec. 1988, International Electron Devices Meeting, San Francisco, Dec. 11-14, 1988.
Patent Abstracts Of Japan, vol. 15, No. 308, (E-1097) Aug./1991 re JP-A-03 110852.

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