Dielectric insulation structure for integrating electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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Details

C257S501000, C257S513000, C257S522000, C257S524000

Reexamination Certificate

active

06888213

ABSTRACT:
A dielectric insulation structure is formed in a silicon layer by integrating a dielectric trench structure therein. The dielectric trench structure defines an insulation well where semiconductor devices are to be integrated therein. The dielectric trench structure is on a hollow region that is completely surrounded by a dielectric area. The dielectric area also forms the side insulation of the dielectric trench structure. The dielectric trench structure is interrupted by a plurality of points to define a plurality of side support regions for the insulation well.

REFERENCES:
patent: 5227658 (1993-07-01), Beyer et al.
patent: 6191467 (2001-02-01), Park et al.

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