Dielectric inks for multilayer copper circuits

Details Dielectric inks for multilayer copper circuits Dielectric inks for multilayer copper circuits

1987-03-02

1989-05-16

Robinson, Ellis P.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 10, 501 17, 501 20, 501 77, 428210, 428 42F, 428901, 428427, 428432, 106 105, 106 113, B32B 300, B32B 900, C03C 1002, B22F 700

Patent

active

048309885

ABSTRACT:
An improved dielectric ink for the fabrication of multilayer integrated circuits is disclosed. The subject inks comprise a devitrifying magnesium-barium-aluminum-zirconium-borophosphosilicate glass frit, an organic vehicle and, optionally, a suitable ceramic filler material. Dielectric layers and stand-alone substrates formed from the subject inks are characterized by good mechanical strength, heat resistance and exceptional density. The subject inks are particularly useful in the fabrication of multilayer circuit structures based on copper since their exceptional density renders them resistant to penetration by flux materials from the copper conductor layers.

REFERENCES:
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patent: 4256796 (1981-03-01), Hans et al.
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patent: 4369220 (1983-01-01), Prabhu et al.
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patent: 4379195 (1983-04-01), Prabhu et al.
patent: 4385127 (1983-05-01), Chyung
patent: 4467009 (1984-08-01), Prabhu et al.
patent: 4551357 (1985-11-01), Takeuchi

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