Dielectric for laser trimming

Details Dielectric for laser trimming Dielectric for laser trimming

1989-01-13

1989-06-13

Carroll, J.

357237, 357 49, H01L 2702, H01L 2712

Patent

active

048397113

ABSTRACT:
The thickness of the dielectric material of an integrated circuit on top of which is provided a semiconductor layer, is selected to be an integer multiple of one-half the wavelength of the laser light in the dielectric material in order to make the dielectric material layer invisible to the laser-trimming light.

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Fowler et al., IBM TDB, 22, 1980, 5473.

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