Dielectric film with low coefficient of thermal expansion...

Details Dielectric film with low coefficient of thermal expansion... Dielectric film with low coefficient of thermal expansion...

2004-06-25

2010-06-29

Wollschlager, Jeffrey (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to work

Molecular aligning or molecular orientating

C264S435000, C264S108000, C264S212000, C264S234000, C264S250000, C264S259000, C264S263000

Reexamination Certificate

active

07744802

ABSTRACT:
An embodiment of the present invention is a technique to provide a dielectric film material with a controllable coefficient of thermal expansion (CTE). A first compound containing a first liquid crystalline component is formed. The first compound is cast into a first film. The first film is oriented in an magnetic or electromagnetic field in a first direction. The first film is cured at a first temperature.

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