Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate
2005-06-14
2005-06-14
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
C174S258000, C361S321100, C361S321500, C427S214000, C427S221000, C427S222000
Reexamination Certificate
active
06905757
ABSTRACT:
An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, “a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 μm in the average particle size DIA, 0.2 to 2.0 μm in the weight cumulative particle size D50based on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D50/DIAwhere the weight cumulative particle size D50and the average particle size DIAobtained by the image analysis”; and the like are used.
REFERENCES:
patent: 5707729 (1998-01-01), Satoh
patent: 6187416 (2001-02-01), Satoh et al.
patent: 6562179 (2003-05-01), Ikeguchi et al.
patent: 6693793 (2004-02-01), Kuwako et al.
patent: 11-207870 (1999-08-01), None
patent: 2001-347600 (2001-12-01), None
patent: 2003-39595 (2003-02-01), None
Ichiryu Akira
Kuwako Fujio
Matsushima Toshifumi
Miwa Hideaki
Sato Tetsuro
Lam Cathy F.
Mitsui Mining & Smelting Co. Ltd.
Rothwell Figg Ernst & Manbeck P.C.
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