Dielectric device and its manufacturing method

Coating processes – Solid particles or fibers applied – Plural particulate materials applied

Reexamination Certificate

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C427S193000

Reexamination Certificate

active

07727585

ABSTRACT:
A manufacturing method of a dielectric device includes steps described below. (1) Mixing step: Powders serving as a matrix and additive powders for sintering the matrix are mixed. (2) Mixture heat-treating step: The mixture of the matrix and the additive that has been subject to the mixing step is heat-treated. (3) Deposition layer formation step: The material powders obtained through the mixture heat-treating step are injected toward a substrate so as to form a deposition layer on the substrate. (4) Deposition layer heat-treating step: The deposition layer formed on the substrate through the deposition layer formation step is heat-treated so as to form the dielectric layer on the substrate.

REFERENCES:
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patent: 2005-183361 (2005-07-01), None
patent: 2005-344171 (2005-12-01), None
Akedo et al., “Microstructure and Electrical Properties of Lead Zirconate Titanate (Pb/Zr52/Ti48)O3) Thick Films Deposited by Aerosol Deposition Method”. Jpn. J. Appl. Phys. vol. 38 (1999), pp. 5397-5401.
Adachi et al., “Preparation of Piezoelectric Thick Films using a Jet Printing System”. Jpn. J. Appl. Phys. vol. 36 (1997), pp. 1159-1163.

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