Dielectric curing of adhesives

Details Dielectric curing of adhesives Dielectric curing of adhesives

1992-12-28

1994-01-11

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

B32B 3100

Patent

active

052777375

ABSTRACT:
A method and apparatus for bonding a non-conductive member to a conductive member by applying adhesive between mating surfaces of the non-conducting and conducting member and placing an electrode adjacent the non-conductive member overlying the mating surface. An RF generator applies an electric field between the non-conducting and conducting members to cure the adhesive by dielectric heating.

REFERENCES:
patent: 2372929 (1945-04-01), Blessing
patent: 2473188 (1949-06-01), Albin
patent: 2504754 (1950-04-01), Sweeny
patent: 2727560 (1955-12-01), Bradley et al.
patent: 3291671 (1966-12-01), Hecht
patent: 3321019 (1967-05-01), Dmitroff et al.
patent: 4293363 (1981-10-01), Wakabayashi et al.
patent: 4320276 (1982-03-01), Takeuchi et al.
patent: 4332713 (1982-06-01), Lehmann
patent: 4420359 (1983-12-01), Goldsworthy
patent: 4427865 (1984-01-01), Watanabe
patent: 4602139 (1986-07-01), Hutton et al.
patent: 4626642 (1986-12-01), Wang et al.
patent: 4648921 (1987-03-01), Nutter et al.
patent: 4650947 (1987-03-01), Hutton et al.
patent: 4654495 (1987-03-01), Hutton et al.
patent: 4749833 (1988-06-01), Novorsky et al.
patent: 4762864 (1988-08-01), Goel et al.
patent: 4776915 (1988-10-01), Natori et al.
patent: 4798925 (1989-01-01), Ishizaka
patent: 4814587 (1986-06-01), Carter
patent: 4816633 (1989-03-01), Mucha et al.
patent: 4878978 (1989-11-01), Goel et al.
"Linear Applications Handbook", National Semiconductor, pp. 262, 257.
Readdy, Jr., "Plastics Fabrication by UV, IR, Induction, Dielectric, & Microwave Radiation Methods," Plastec Report R43, Picatinny Arsenal, Dover, N.J., Apr. 1976, pp. 106-107.

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