Dielectric composition for use in circuitized substrates and...

Details Dielectric composition for use in circuitized substrates and... Dielectric composition for use in circuitized substrates and...

2011-04-26

2011-04-26

Harlan, Robert D. (Department: 1762)

Compositions

Fluent dielectric

C252S573000, C252S578000

Reexamination Certificate

active

07931830

ABSTRACT:
A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, significantly, only a minor amount of bromine. A circuitized substrate comprised of one or more of these dielectric layers and one or more conductive layers is also provided.

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