Dielectric composition for forming dielectric layer for use...

Details Dielectric composition for forming dielectric layer for use... Dielectric composition for forming dielectric layer for use...

2007-09-18

2007-09-18

Harlan, Robert D. (Department: 1713)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098100, C427S099400

Reexamination Certificate

active

10812889

ABSTRACT:
A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.

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