Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1991-09-16
1993-03-16
Dzierzynski, Paul M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257779, H01L 29167
Patent
active
051949300
ABSTRACT:
Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.
REFERENCES:
patent: 3281491 (1966-10-01), Smith et al.
patent: 3849187 (1974-11-01), Fetscher et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4698402 (1987-10-01), Kordomenos et al.
patent: 4710796 (1987-12-01), Ikeya et al.
patent: 4736012 (1988-04-01), Shoji et al.
patent: 4769425 (1988-09-01), Dervan et al.
patent: 4892894 (1990-01-01), Koleske
patent: 4999699 (1991-03-01), Christie
patent: 5043221 (1992-08-01), Koleske
Christie Frederick R.
Papathomas Kostas
Poliks Mark D.
Wang David W.
Dzierzynski Paul M.
Goldman Richard M.
International Business Machines
Olsen Judith D.
Ratliff R. A.
LandOfFree
Dielectric composition and solder interconnection structure for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dielectric composition and solder interconnection structure for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dielectric composition and solder interconnection structure for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-354344