Die thinning apparatus

Abrading – Abrading process – Glass or stone abrading

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451386, 451398, 451402, 451441, B24B 4106

Patent

active

060103922

ABSTRACT:
A fixture for holding a semiconductor die against an abrasive media for the purpose of thinning the die is described. The fixture provides means for aligning the back of the die to a reference plane that is coplanar with the plane of the abrasive and is in contact with the abrasive media during the thinning process.

REFERENCES:
patent: 3562965 (1971-02-01), Lange
patent: 3665648 (1972-05-01), Yamanaka
patent: 3867797 (1975-02-01), Meier
patent: 3888053 (1975-06-01), White et al.
patent: 4020600 (1977-05-01), Day
patent: 4043080 (1977-08-01), Maxwell
patent: 4502225 (1985-03-01), Lin
patent: 4944119 (1990-07-01), Gill, Jr. et al.
patent: 5089081 (1992-02-01), Bedzyk
patent: 5309628 (1994-05-01), Fukuchi et al.
patent: 5433378 (1995-07-01), Orlandi
patent: 5468177 (1995-11-01), Kindler et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5681215 (1997-10-01), Sherwood et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 04, Sep., 1988, "Multi-Prupose Lapping/Polishing Fixture for Microanalysis".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Die thinning apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die thinning apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die thinning apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1068249

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.