Die-stamped circuit board assembly having relief means to preven

Details Die-stamped circuit board assembly having relief means to preven Die-stamped circuit board assembly having relief means to preven

1982-01-04

1983-07-19

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

361404, 29832, H05K 320

Patent

active

043947093

ABSTRACT:
A photoflash device circuit board assembly including a dielectric substrate and at least one switching element and conductor die-stamped therein. To assure that the delicate switch is not severed by the die's cutting edge during die-stamping, a relief means (e.g., slot) is provided within the substrate so that a segment of the switch can be aligned therewith. As an alternative, it is taught to provide stepped portions within the die's cutting edge to align with preselected portions of the switch and thus prevent total severance thereof.

REFERENCES:
patent: 2772501 (1956-12-01), Malcolm
patent: 3253324 (1966-05-01), Frey et al.
patent: 3543397 (1970-12-01), Hoagland et al.
patent: 3823344 (1974-07-01), Havas
patent: 3911716 (1975-10-01), Weglin
patent: 4017728 (1977-04-01), Audese et al.
patent: 4028798 (1977-06-01), Bechard et al.
patent: 4030001 (1977-06-01), Medley et al.
patent: 4113424 (1978-09-01), Armstrong et al.

Affiliated with

Also associated with

Rating

Die-stamped circuit board assembly having relief means to preven does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die-stamped circuit board assembly having relief means to preven, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die-stamped circuit board assembly having relief means to preven will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-754564