Die-stamped circuit board assembly for photoflash devices

Details Die-stamped circuit board assembly for photoflash devices Die-stamped circuit board assembly for photoflash devices

1982-01-04

1983-07-19

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

361404, 156261, H05K 320

Patent

active

043947107

ABSTRACT:
A circuit board assembly wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material.

REFERENCES:
patent: 2772501 (1956-12-01), Malcolm
patent: 3253324 (1966-05-01), Frey et al.
patent: 3543397 (1970-12-01), Hoagland et al.
patent: 3823344 (1974-07-01), Havas
patent: 3911716 (1975-10-01), Weglin
patent: 4017728 (1977-04-01), Audese et al.
patent: 4020798 (1977-06-01), Bechard et al.
patent: 4030001 (1977-06-01), Medley et al.
patent: 4113424 (1978-09-01), Armstrong et al.

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