Die stacking scheme

Details Die stacking scheme Die stacking scheme

2006-03-07

2006-03-07

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S724000

Reexamination Certificate

active

07008823

ABSTRACT:
An improved semiconductor die stacking scheme is provided. In accordance with one embodiment of the present invention, a method of stacking a plurality of semiconductor die is provided. In accordance with another embodiment of the present invention a multiple die semiconductor assembly is provided. Each embodiment relates generally to a stacked semiconductor die assembly including a substrate, first and second semiconductor dice including stacking surfaces and active surfaces, a decoupling capacitor, and one or more conductive lines connecting elements of the assembly.

REFERENCES:
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5107328 (1992-04-01), Kinsman
patent: 5212402 (1993-05-01), Higgins, III
patent: 5247423 (1993-09-01), Lin
patent: 5254871 (1993-10-01), Benavides et al.
patent: 5283717 (1994-02-01), Hundt
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5379189 (1995-01-01), Merriman
patent: 5418752 (1995-05-01), Harari et al.
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5532910 (1996-07-01), Suzuki et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5652463 (1997-07-01), Weber et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5674785 (1997-10-01), Akram et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5701033 (1997-12-01), Ueda et al.
patent: 5808878 (1998-09-01), Saito et al.
patent: 5811879 (1998-09-01), Akram
patent: 5838546 (1998-11-01), Miyoshi
patent: 5898224 (1999-04-01), Akram
patent: 5923090 (1999-07-01), Fallon et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 5969426 (1999-10-01), Baba
patent: 5973403 (1999-10-01), Wark
patent: 5982038 (1999-11-01), Toy et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 5994773 (1999-11-01), Hirakawa
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6013877 (2000-01-01), Degani et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6069025 (2000-05-01), Kim
patent: 6081023 (2000-06-01), Murakami et al.
patent: 6087717 (2000-07-01), Ano et al.
patent: 6093957 (2000-07-01), Kwon
patent: 6093969 (2000-07-01), Lin
patent: 6118176 (2000-09-01), Tao et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6181002 (2001-01-01), Juso et al.
patent: 6222246 (2001-04-01), Mak et al.
patent: 6236109 (2001-05-01), Hsuan et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6300163 (2001-10-01), Akram
patent: 6303981 (2001-10-01), Moden
patent: 6316727 (2001-11-01), Liu
patent: 6335566 (2002-01-01), Hirashima et al.
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6344682 (2002-02-01), Tomita
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 6407456 (2002-06-01), Ball
patent: 6441483 (2002-08-01), Akram
patent: 6462412 (2002-10-01), Kamei et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6646334 (2003-11-01), Hur
patent: 6707141 (2004-03-01), Akram
patent: 6884658 (2005-04-01), Akram
patent: 2001/0015485 (2001-08-01), Song et al.
patent: 2002/0074668 (2002-06-01), Hofstee et al.
patent: 2002/0074669 (2002-06-01), Watanabe et al.
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2002/0079573 (2002-06-01), Akram
patent: 59-48949 (1984-03-01), None
patent: 359111350 (1984-06-01), None
patent: 61-147559 (1986-07-01), None
patent: 02-158147 (1990-06-01), None
patent: 403096266 (1991-04-01), None
patent: 403187253 (1991-08-01), None
patent: 04-155857 (1992-05-01), None
patent: 5-343603 (1993-12-01), None
patent: 2001102512 (2001-04-01), None
patent: 02001308140 (2001-11-01), None
patent: WO 97/37374 (1997-10-01), None
DERW 2001-577215, May 7, 2001, Han.
“Multi-Chip Module on Laminate, High-performance packaging for today's silicon,” IBM Microelectronics, 1998.

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