Die sorter

Details Die sorter Die sorter

1994-07-20

1997-08-05

Picardat, Kevin

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438 17, 438460, H01L 2100

Patent

active

056542046

ABSTRACT:
An integrated circuit probing method and apparatus therefor. The apparatus includes a main system controller coupled to a network interface, graphic user interface, and equipment interface. A high speed bus connects the main system controller to a group of subsystems. The subsystems includes subsystems such as input cassettes, input frame handing, frame to align, die align, die probing, die bin and die output, output cassettes subsystem, among others. The integrated circuit probing apparatus allows for probing of each individual die through the die probing subsystem, typically a high speed subsystem.

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patent: 5393706 (1995-02-01), Mignardi et al.
patent: 5396068 (1995-03-01), Bethea

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