Metal fusion bonding – Including means to force or clamp work portions together...
Reexamination Certificate
2000-03-17
2001-10-23
Elve, M. Alexandra (Department: 1725)
Metal fusion bonding
Including means to force or clamp work portions together...
C228S001100, C228S183000, C029S890032
Reexamination Certificate
active
06305595
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a die set for welding a panel like heat pipe to a heat sink, by the die set used in welding, the die set is provided to make the panel like heat pipe with extremely high heat conductivity effective in combining with the heat sink for use. Heat conducting efficiency of the heat sink can thus be increased. The present invention especially suits to solve the heat-sinking problem resided in CPU's in computer industry.
2. Description of the Prior Art
As is well known, a CPU in a computer may generate large amount of heat during operation, and the faster the speed of operation is, the larger the amount of watt generated will be. When temperature on the CPU is too high, operation of it will be adversely influenced to induce failure of the computer. Thereby, if the heat-sinking problem is not solved, speed of operation of the CPU will be limited, so that the CPU cannot be developed toward the goal of having performance of high speed.
A computer includes a conventional heat sink which is comprised of an aluminum panel and a plurality of heat sinking fins, the aluminum panel is provided on the top of a CPU to absorb heat of the CPU and conduct to the heat sinking fins. Then the heat sinking fins make heat exchange with cool air to lower temperature of the CPU.
In the conventional heat sink for a computer, if the computer is a desktop computer which has a larger mainframe, it has a larger space internally, and a fan can be added on the heat sink to speed up heat exchange of the fins with cool air, such situation can afford a CPU with higher speed for heat sinking; if the computer is a notebook computer which is lighter, thinner and convenient for carrying, a fan added thereon may increase its thickness and does not meet the idea of design of such a notebook computer. Therefore, it is not an ideal way to add a fan thereon to speed up heat sinking of the CPU.
The above stated way of adding fan does not solve the heat-sinking problem resided in a CPU, the main reason thereof is limitation of space, if temperature of the CPU can be transmitted to a larger space, such problem can be easily solved. There are computer manufacturers to connect heat sinks to the housings of computers made of aluminum magnesium alloy to render heat to be transmitted to outside. However, according to results of tests, lowering of temperature by such is quite limited, the problem is evidently that heat cannot be transmitted very fast and effectively to the housings of the computers made of aluminum magnesium alloy. In view of this, solving the problem of heat conducting is the most important subject in development of heat sinks for the CPU's.
In other words, if the problem of heat conducting in heat sinks for the CPU's can be overcome, development of computers in the future must be contributive, and this is the motive of study and development of the present invention.
SUMMARY OF THE INVENTION
In view of this, the inventor provides the present invention after continuous study and development in overcoming the problem against the situations stated above and based upon his professional and doctoral knowledge (from Ohio State University) of manufacturing engineering and practical experience of years in study, designing and development of the structure of such products entrusted by computer manufacturers. The present invention can solve the problems resided in heat conducting in heat sinks for the CPU's of computers.
In the process of study and development of the present invention, the main work is to combine a heat pipe with a heat sink. In the technique of heat conducting, a heat pipe which is called a “super heat conductor” has a heat conductivity which is larger than 10,000 W/M° C., this is more than 30 folds as of that of copper (being 300 W/M° C.); and it is structurally simple, light weighted and highly reliable, thereby, it is an essential element for satellites and space ships. If the heat pipe and the heat sink can be combined with each other, the heat sink must have the best performance due to providing the excellent heat conductivity.
Before combination of the heat pipe and the heat sink, the first problem encountered is that a normal heat pipe is a round pipe; its contact area with the top of a CPU is too small to effectively absorb heat. According to investigation by the inventor of the present invention, there have been panel-like heat pipes developed in Japan and the U.S.A. as shown in
FIGS. 1
to
3
. The panel-like heat pipes are rectangular and are comprised each of a top plate
60
and a bottom plate
70
, wherein, the bottom plate
70
is provided with a peripheral frame
71
which is provided with a partition rib
72
, when the top plate
60
is lapped over the bottom plate
70
, air in several separated spaces
73
divided from the bottom plate
70
by the peripheral frame
71
and the partition rib
72
are drawn out to form vacuum state, and the separated spaces
73
are placed therein with a capillary structure and condensate (vacuum state, a capillary structure and condensate are the three necessary elements for forming a heat pipe, and this is a conventional technique, and is not described further in detail). The top surfaces of the peripheral frame
71
and the partition rib
72
are welded to the top plate
60
to form a panel-like heat pipe.
A conventional panel-like heat pipe stated above still has two problems to be solved if they are used in a heat sink:
1. When the top surfaces of the peripheral frame
71
and the partition rib
72
are welded to the top plate
60
, welding needs high temperature, the external surfaces of the top plate
60
and the bottom plate
70
will be undulate and uneven; this may adversely influence speed of heat absorbing.
2. The panel-like heat pipe and the heat sink are two individual members, if the panel-like heat pipe is adhered to the top surface of the heat sink with thermal grease, the heat absorbed by the heat sink cannot be transmitted to the panel-like heat pipe; thereby, time for heat absorbing of the panel-like heat pipe is dragged.
The way to solve the aforesaid first problem by the inventor of the present invention is to heat the area to be combined with by using high periodic waves, thereby, the trouble of deformation to make the panel-like heat pipe undulate and uneven can be solved. The way to solve the aforesaid second problem of the present invention is to directly combine the panel-like heat pipe with the heat sink during manufacturing; thereby, there will be no problem in worrying how to combine the two separated members.
The ways to solve the aforesaid two problems look simple, but they are uneasy in practice, the inventor of the present invention provides a die set for processing after continuous study and tests.
The die set for welding process of the present invention to combine the panel-like heat pipe with the heat sink is comprised of a first and a second die seat. The first die seat is placed under a heat conductive bottom plate, and the top thereof is provided at least with a first frame-like stub of which the top surface is provided with a lot of protruding granules. The second die seat is placed above a heat conductive top plate, and the bottom thereof is provided at least with a second frame-like stub (in opposition to that of the first die seat) of which the bottom surface is also provided with a lot of protruding granules. The heat conductive top plate is lapped over the heat conductive bottom plate with a connecting frame therebetween in opposition to and having a shape similar to that of any of the first and second frame-like stubs. The connecting frame is in a vacuum state internally, and is provided therein with a capillary structure and condensate. The end faces of the first and the second frame-like stubs are treated by pulsation with high periodic waves to integrally combine the connecting frame, the heat conductive top plate and the heat conductive bottom plate; thereby the heat conductive top plate and the heat
Bacon & Thomas PLLC
Edmondson L.
Elve M. Alexandra
LandOfFree
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