Die seal structure for a semiconductor integrated circuit

Details Die seal structure for a semiconductor integrated circuit Die seal structure for a semiconductor integrated circuit

1997-01-21

1998-11-03

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

257619, 438462, H01L 23544

Patent

active

058313303

ABSTRACT:
A die seal structure for a small-dimension semiconductor integrated circuit is disclosed. The die seal structure, which lies between an integrated circuit region and a scribe line over a semiconductor wafer, includes at least one dielectric layer over the semiconductor wafer. At least one contact window is formed in the dielectric layer. The die seal structure further includes at least one plug each filled in one of the contact windows.

REFERENCES:
patent: 5414297 (1995-05-01), Morita et al.
patent: 5559362 (1996-09-01), Narita
patent: 5665655 (1997-09-01), White
patent: 5698892 (1997-12-01), Koizumi et al.

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