Die push-up device

Details Die push-up device Die push-up device

1996-08-16

1998-05-26

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 495, H05K 330

Patent

active

057553734

ABSTRACT:
A die push-up device used in a bonding machine for semiconductor devices, etc. including a wafer sheet suction assembly and a wafer push-up needle which are moved up and down independently by a suction assembly raising-and-lowering cam and a push-up needle raising-and-lowering cam which are respectively rotated by a suction assembly raising-and-lowering motor and a push-up needle raising-and-lowering motor.

REFERENCES:
patent: 4599037 (1986-07-01), Ross, Jr., et al.

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