Die presentation system for die bonder

Details Die presentation system for die bonder Die presentation system for die bonder

1992-06-02

1993-04-20

Huppert, Michael S.

Material or article handling

Apparatus for charging a load holding or supporting element...

Transporting means is a horizontally rotated arm

414331, 414DIG7, 4147448, B25J 904

Patent

active

052036596

ABSTRACT:
A die presentation package exchange system for use in a hybrid die bonder, in particular an automatic hybrid die bonder, which system comprises a magazine (10) for storing a plurality of die presentation packages (12). The system further comprises a clamp assembly (40), adapted to collect a selected die presentation package (12) from the magazine (10) and feed it to a die eject station (204) of the die bonding machine. The clamp assembly (40) is further adapted to retrieve the die presentation package (12) from the die eject station (204) after a predetermined number of dice have been ejected, and return it to the magazine (10). The magazine (10) further comprises indexing structure for indexing movement of the packages (12) within the magazine (10) so that the selected package is located at a collection point for collection from the magazine (10). The system further comprises indexing structure for indexing rotation of the clamp assembly (40) about its axis (62). The die presentation package exchange system makes it possible to change from one die presentation package to another with minimum delay, and consequently minimum loss in production time.

REFERENCES:
patent: 3534862 (1970-10-01), Shambelan
patent: 3572519 (1971-03-01), Tezuka
patent: 3894671 (1975-07-01), Kulicke
patent: 4527936 (1985-07-01), Hartlieb
patent: 4563664 (1987-03-01), Hineno
patent: 4817795 (1989-04-01), Kos
patent: 5007784 (1991-04-01), Genov et al.

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