Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1997-12-18
1999-11-30
Kelley, Nathan K.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257704, H01L 2348
Patent
active
059947845
ABSTRACT:
An integrated circuit die or chip may be positioned within an integrated circuit package by providing a spacer connected to the die and extending upwardly therefrom. When the die is overmolded, the spacer contacts the mold and spaces the die with respect to the mold. By forming the spacer using conventional wire bonding techniques, no additional process steps are necessary in forming the spacer and no additional parts are needed. The spacer wire bonds may be formed with wires which extend upwardly above the remaining wires, protecting the remaining wires from being contacted by the mold or from being positioned too close to the upper surface of the resulting molded package.
Kelley Nathan K.
Micro)n Technology, Inc.
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