Plastic article or earthenware shaping or treating: apparatus – Means providing a shaping orifice – Single inlet – plural shaping orifices
Reexamination Certificate
2007-12-25
2007-12-25
Davis, Robert B. (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Means providing a shaping orifice
Single inlet, plural shaping orifices
C425S463000
Reexamination Certificate
active
11076876
ABSTRACT:
In a die plate having a hardened surface for sliding a knife, a plurality of WC alloy plates1bare diffusion-bonded to a base metal2b, whereby the hardened surface h is formed. A plurality of nozzle holes4a, 4a. . . are formed on each of the WC alloy plates1b. Each of the WC alloy plates1bis formed into a shape having a thickness of 2.5 mm or more and two adjacent edges 20 mm or more in length, wherein each edge is 200 mm or less in length. The die plate has high freedom in an arrangement of nozzle holes to enable a close arrangement of a number of nozzle holes, has an extended life with hardly causing dropping-off of a member constituting a hardened surface, and can be produced with a minimized number of processes.
REFERENCES:
patent: 3452394 (1969-07-01), McNeal, Jr.
patent: 4088433 (1978-05-01), Simpson
patent: 4720251 (1988-01-01), Mallay et al.
patent: 5620130 (1997-04-01), Schneider et al.
patent: 5761787 (1998-06-01), Kragle et al.
patent: 6521353 (2003-02-01), Majagi et al.
patent: 2005/0035483 (2005-02-01), Jackson et al.
patent: 1 116 570 (2001-07-01), None
patent: 60190526 (1985-09-01), None
patent: 5-124035 (1993-05-01), None
JPO Machine Translation of JP 05-124035, Published May 21, 1993.
Konno Masashi
Nagami Nobuki
Shigeno Atsushi
Takeda Hiroyuki
Tatsuda Osamu
(Kobe Steel, Ltd.)
Chaet Marissa W
Davis Robert B.
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