Die placement tool or the like

Details Die placement tool or the like Die placement tool or the like

1976-03-22

1978-01-03

Kelly, Donald G.

Metal fusion bonding

Means to bond by applying only pressure

228 6A, H01L 2160

Patent

active

040662004

ABSTRACT:
A mechanism having first means for moving a tool or the like in an up and down direction and second means for moving such device in a fore and aft direction. The mechanism is suitable for a number of different uses and is especially adapted for die bonding operations wherein a die is picked up at one location and transferred to a second location. The mechanism also has means for imparting reciprocatory motion to the device so that, if the device is a die placement tool, the tool can be utilized to provide a scrubbing action for the die on a substrate therebelow.

REFERENCES:
patent: 3342395 (1967-09-01), Diepeveen
patent: 3451607 (1969-06-01), Miller et al.
patent: 3479716 (1969-11-01), Zanger et al.
patent: 3762015 (1973-10-01), Radobenko
patent: 3790738 (1974-02-01), Laub et al.

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