Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2010-03-01
2010-10-26
Osele, Mark A (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200, C438S464000, C438S976000
Reexamination Certificate
active
07820006
ABSTRACT:
A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.
REFERENCES:
patent: 6561743 (2003-05-01), Nakatsu
patent: 7238593 (2007-07-01), Medding et al.
patent: 2002/0129899 (2002-09-01), Mimata et al.
patent: 2005/0255673 (2005-11-01), Cheung et al.
patent: 2009/0075459 (2009-03-01), Sato et al.
patent: 2009/0101282 (2009-04-01), Fujino et al.
patent: 2010/0038031 (2010-02-01), Koike
patent: 2001-118862 (2001-04-01), None
patent: 3209736 (2001-07-01), None
patent: 2006-156806 (2006-06-01), None
patent: 4215818 (2008-11-01), None
patent: 2008004270 (2008-01-01), None
patent: 2009/136450 (2009-11-01), None
patent: 2010/001497 (2010-01-01), None
International Search Report dated Oct. 13, 2009, from the corresponding International Application.
Takahashi Kuniyuki
Umehara Okito
Katten Muchin Roseman LLP
Osele Mark A
Shinkkawa Ltd.
LandOfFree
Die pickup apparatus for picking up semiconductor dies and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die pickup apparatus for picking up semiconductor dies and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die pickup apparatus for picking up semiconductor dies and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4225220