Die pick mechanism for automatic assembly of semiconductor devic

Details Die pick mechanism for automatic assembly of semiconductor devic Die pick mechanism for automatic assembly of semiconductor devic

1982-12-06

1988-06-07

Spar, Robert J.

Material or article handling

Elevator or hoist and loading or unloading means therefor

Grab

B65G 4700

Patent

active

047493291

ABSTRACT:
Automatic assembly equipment for semiconductor devices comprises die or chip selection, transport, and bonding operations coordinated to obtain high production rates. Die selection means comprises a capillary and a needle, positioned on opposite sides of the wafer, which act together to lift the chip out of the plane of the wafer and load the capillary. The transport mechanism comprises a sheave driven carriage for transporting the chip without subjecting the chip to excessive acceleration. The bonding apparatus comprises a slot and gear arrangement for transporting and locating a lead frame and a heater for bonding the chip to the appropriate part of the lead frame.

REFERENCES:
patent: 3432213 (1969-03-01), Adams
patent: 3439581 (1969-04-01), Wilkins
patent: 3813789 (1974-06-01), Shelton
patent: 3834558 (1974-09-01), Bru
patent: 3973682 (1976-08-01), Neff
patent: 4135630 (1979-01-01), Snyder et al.
patent: 4266905 (1981-05-01), Birk et al.

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