Die package having an adhesive flow restriction area

Details Die package having an adhesive flow restriction area Die package having an adhesive flow restriction area

2004-09-01

2009-02-17

Wojciechowicz, Edward (Department: 2895)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S112000, C438S116000, C438S118000, C438S127000

Reexamination Certificate

active

07491570

ABSTRACT:
A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.

REFERENCES:
patent: 6225695 (2001-05-01), Chia et al.
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6744109 (2004-06-01), Barton et al.
patent: 7067358 (2006-06-01), Chen-Tung et al.
patent: 2001/0014486 (2001-08-01), Glenn

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