Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2002-04-08
2004-11-30
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S678000, C257S684000, C257S704000, C257S707000, C257S710000, C257S730000, C438S112000, C438S124000, C438S127000
Reexamination Certificate
active
06825572
ABSTRACT:
TECHNICAL FIELD
The present invention relates generally to circuit packaging, and in particular to apparatus and methods for packaging integrated circuits.
BACKGROUND
Integrated circuits are formed in dies on wafers. The dies are diced into individual die that are packaged to protect the die. A die package provides protection of the die from environmental factors, electrical and physical connection to circuits, and heat dispersion from the die.
FIG. 1
shows a conventional die package
100
. Package
100
includes a die
105
and attachment paste
107
physically connecting the die to a substrate
110
. The paste
107
, when applied or when the die is pressed onto the paste, bleeds out from underneath the die
105
. A plurality of wire bonds
112
electrically connect the die to pads
114
on the substrate
110
. Substrate pads
114
are positioned outwardly of the die
105
and the paste
107
. Thus, the substrate has a greater surface area than the die. The substrate pads
114
are, through vias
116
, electrically connected to solder balls
120
. Solder balls
120
are adapted to electrically connect to circuits outside the package
100
. An encapsulant
125
covers the top and sides of die
105
. The encapsulant
125
and the substrate
110
define a substantially cube-shaped structure. Accordingly, the encapsulant
125
extends outwardly from the die
105
a sufficient distance
130
to cover the wire bonds
112
and substrate pads
114
. Typically the distance
130
is over 1.00 millimeters. In one conventional package
100
, the distance is 1.25, which adds 2.5 millimeters to the width of the package
100
due to the distance
130
being on left and right sides of the die
105
as shown in FIG.
1
. One current technique has reduced the distance
130
to 1.0 millimeter. It is desired to reduce the distance the encapsulant extends outwardly of the die to provide a narrow package or allow the packaging of larger die.
For the reasons stated above, for other reasons stated below, and for other reasons which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for an improved electronic component package and methods of packaging electronic components.
SUMMARY
The present invention is directed to an integrated circuit die package. An embodiment of the present invention includes connecting a die to a substrate to form a package, wherein the connecting material remains under the die. In an embodiment, the connecting material covers a smaller area of the substrate than the area that the die covers. This allows substrate contacts to be moved inwardly from the outer edge of the substrate without being contacted or fouled by the connecting material. In an embodiment, the connecting material includes an adhesive layer. In an embodiment, the connecting material includes an adhesive tape. In an embodiment, the connecting material includes a paste layer. An embodiment of the paste layer bleeds out from under the element that contacts the paste layer. Consequently, in this embodiment, a spacer that is smaller in area than the die is provided and contacts the paste layer so that the paste layer does not extend outwardly of the die. In an embodiment, the connecting structure includes an adhesive layer connected to the die, a spacer connected to the adhesive layer, and a paste affixing the spacer to the substrate. In an embodiment, the spacer is smaller than the die, thus a void extends around the spacer between the die and substrate. Any paste bleed out from beneath the spacer remains in the void.
The present invention also includes a package including a die that is elevated from the substrate to which the die is attached. In an embodiment, the die is elevated by only an adhesive layer. In an embodiment, the die is elevated by a support assembly that also affixes the die to the substrate.
The present invention also includes methods for packaging integrated circuit dies. An embodiment of the present invention includes keeping any connection material beneath the die. Thus, the substrate contacts can be moved inwardly closer to the die. In an embodiment, the connection material includes a paste. In an embodiment, the connection material is an adhesive layer. Other methods will be apparent from reading the disclosure.
The present invention also includes electrical devices, memory units, memory modules, electrical systems, computers, which include a packaging according to the present invention.
These and other embodiments, aspects, advantages, and features of the present invention will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art by reference to the following description of the invention and referenced drawings or by practice of the invention. The aspects, advantages, and features of the invention are realized and attained by means of the instrumentalities, procedures, and combinations particularly pointed out in the appended claims.
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patent: 6310390 (2001-10-01), Moden
patent: 6492717 (2002-12-01), Gore et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6564454 (2003-05-01), Glenn et al.
patent: 2002/0009766 (2002-01-01), Chen et al.
Chye Lim Thiam
Tian Edmund Lua Koon
Nelms David
Schwegman Lundberg Woessner & Kluth P.A.
Tran Long
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