Die-mounting paddle for mechanical stress reduction in plastic I

Details Die-mounting paddle for mechanical stress reduction in plastic I Die-mounting paddle for mechanical stress reduction in plastic I

1990-02-20

1991-06-04

James, Andrew J.

Fishing, trapping, and vermin destroying

437220, H01L 2348

Patent

active

050218646

ABSTRACT:
An improved die-mounting paddle for mechanical stress reduction in plastic integrated circuit packages. The paddle, which is incorporated in a leadframe, comprises multiple, coplanar floating sub-paddles, each of which is attached to a support beam by a flexible coil, thus allowing a large die to remain firmly attached to each of the pads, in spite of differences in the coefficients of expansion between the leadframe paddle metal and the die that might well result in bonding wire breakage or die breakage if a conventional single large paddle were utilized.

REFERENCES:
patent: 4331831 (1982-05-01), Ingram et al.
patent: 4445271 (1984-05-01), Grabbe
patent: 4794431 (1988-12-01), Park
patent: 4797726 (1989-01-01), Manabe
patent: 4809054 (1989-02-01), Waldner
patent: 4809135 (1989-02-01), Yerman
patent: 4829362 (1989-05-01), Tran et al.
patent: 4855807 (1989-08-01), Yamaji et al.

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