Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2003-12-24
2008-12-16
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S248000, C156S250000, C156S345420, C264S272150, C264S272170, C264S492000, C264S494000, C029S832000
Reexamination Certificate
active
07465368
ABSTRACT:
An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation.
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Abstract of RD 266,009 A.
Cheong Yew Wee
Lim Sheou Hooi
Lim Szu Shing
Blakely , Sokoloff, Taylor & Zafman LLP
Chan Sing P
Intel Corporation
Tucker Philip C
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